Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4727308

Anmeldetag

24. September 2025

Veröffentlichung

15. April 2026

Rechtsraum

EP

Abstract

An electronic device includes a substrate, a circuit layer, a semiconductor chip, and a sensing element. The circuit layer is disposed on the substrate. The semiconductor chip is disposed over the substrate and the circuit layer, and is electrically connected to the circuit layer. The semiconductor chip includes a semiconductor die, an underfill layer surrounding the semiconductor die, a reflective layer arranged around the underfill layer, and a transparent conductive layer arranged on the semiconductor die and electrically connected to the circuit layer. The sensing element is at least partially overlapped with the substrate.

Anmelder

Firma

InnoLux Corporation

Land

🇹🇼 Taiwan