Systeme und Verfahren zur Halbleiterkapselung unter Verwendung von Hohlraumintegrationen von Leiterplatten (pcb)

Details

Veröffentlichungs-Nr.

EP4730926

Anmeldetag

7. Oktober 2025

Veröffentlichung

22. April 2026

Rechtsraum

EP

Abstract

The subject technology is directed to a semiconductor device and methods for its fabrication and use. In an embodiment, the subject technology provides a semiconductor device that comprises a substrate having a first side and a second side. The second side comprises a cavity. A first circuit is coupled to the first side of the substrate and is characterized by a first thickness. A second circuit, comprising an RF component, is positioned within the cavity on the second side of the substrate and is characterized by a second thickness greater than the first thickness. The cavity is characterized by a first depth less than or equal to the second thickness. This configuration allows the RF component to be embedded within the substrate, optimizing the device's height and improving space utilization for compact electronic devices. There are other embodiments as well.

Anmelder

Firma

Avago Technologies International Sales Pte. Limited

Land

🇸🇬 Singapur