Chemisch Vorgespanntes Mikrokristallines Glas sowie Herstellungsverfahren und Anwendung davon
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4733279
- Anmeldetag
- 28. April 2022
- Veröffentlichung
- 29. April 2026
- Rechtsraum
- EP
- IPC
- C03B32/02
Abstract
Embodiments of this application disclose chemically toughened microcrystalline glass and a preparation method and application thereof. The chemically toughened microcrystalline glass has a Na/Li exchange layer, and has a compressive stress layer. A depth of the compressive stress layer and a total thickness t of the chemically toughened microcrystalline glass meet the following: the depth of the compressive stress layer is 0.15 t to 0.22 t. In addition, a compressive stress intensity CS50 at a toughening depth of 50 µm in a surface layer of the chemically toughened microcrystalline glass and the total thickness t of the chemically toughened microcrystalline glass meet the following: CS50 is 130 + (20 t - 13) × 15 Mpa to 230 + (20 t - 13) × 15 MPa. In addition, CS50 and the depth of the compressive stress layer meet the following: CS50/(Doc - 50) is 1.4 to 6. The chemically toughened microcrystalline glass has strong piercing resistance to a rough ground, and a chemical toughening condition for the preparation method of the chemically toughened microcrystalline glass is easy to control, so that prepared chemically toughened microcrystalline glass has stable performance, high efficiency, and reduced preparation costs.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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