Nichtstrukturelle Lagen an einer Dichtung für Kühlluft und Verfahren dafür
Anmelder: RTX Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4733291
- Anmeldetag
- 3. Oktober 2025
- Veröffentlichung
- 29. April 2026
- Rechtsraum
- EP
- IPC
- C04B35/80, C04B37/00
Abstract
The incorporation of non-structural ceramic plies to a CMC component (10) or preform is used to provide one or more passages (25) allows for cooling air (45) to pass between segregated cooling cavities. In various embodiments, this may include preforming additional layers of non-structural plies (20) to allow for machining of one or more metered passages (25), or the incorporation of a pre-formed passage or passages (25) into non-structural ply layups. The one or more passages (25) may be machined and/or preformed and may include cylindrical, racetrack, slot, conical or similar geometries. The one or more passage (25) may be used to pass cooling air (45) between cavities separated by sealing features (W-seal, feather seal, etc.). Bypassing discrete sealing features is beneficial to control and/or meter cooling air flow (45) between high-pressure and lower-pressure cavities.
Anmelder
- Firma
- RTX Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Luft- und Raumfahrt- sowie Verteidigungskonzern, entstanden aus Raytheon und United Technologies. Entwickelt und fertigt Triebwerke, Avionik, Radarsysteme, Raketen- und Verteidigungstechnik für zivile und militärische Kunden.
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