Wärmehärtende Harzzusammensetzung und Halbleiterbauelement

Details

Veröffentlichungs-Nr.

EP4733350

Anmeldetag

17. Oktober 2025

Veröffentlichung

29. April 2026

Rechtsraum

EP

IPC

C08K3/00, C08G59/00, C08K5/54(삼성에스디아이 주식회사)

Abstract

One of the purposes of the present invention is to provide a thermosetting resin composition with excellent adhesion to metals. A thermosetting resin composition, comprising the following components (A) to (D): (A) a thermosetting resin; (B) a silane coupling agent represented by the following formula (I): <img class="EMIRef" id="7f6add92-dc90-4b3b-a49f-a0a513967bf0-ia01" /> wherein, in formula (I), R<1> is, independently of each other, an alkyl group having 1 to 8 carbon atoms, m is an integer of 1 to 3, n is an integer of 0 to 10, Q is a single bond or an amide bond (-NHCO-), A is a nitrogen-containing heterocyclic group having at least two nitrogen atoms, wherein one of the nitrogen atoms is bonded to the carbon atom of -(CH<2>)<n>- or of -NHCO-; (C) a curing accelerator; and (D) an inorganic filler.

Anmelder

Firma

SHIN-ETSU CHEMICAL CO., LTD.

Land

🇯🇵 Japan

Fachgebiete