Lautsprechermodul und Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4734552
- Anmeldetag
- 18. März 2024
- Veröffentlichung
- 6. Februar 2025
- Rechtsraum
- EP
- IPC
- H04R9/06
Abstract
Embodiments of this application provide a speaker module and an electronic device, and relate to the technical field of electronic devices, to prevent the electronic device from producing harsh sound when using a speaker for sound production, thereby improving user experience. The electronic device includes an overall housing and at least one speaker, the overall housing has an overall cavity, and the speaker is located inside the overall cavity. A sound outlet hole is provided on the overall housing. The speaker includes a speaker kernel, a front cavity, and a rear cavity, the front cavity has a sound outlet channel, and the sound outlet channel is in communication with the sound outlet hole. The speaker further includes an auxiliary cavity, and at least a part of the auxiliary cavity is located on a side of the front cavity facing away from the speaker kernel. The auxiliary cavity includes a transmission channel and a silencing cavity in communication with the transmission channel, the transmission channel is in communication with the front cavity through an auxiliary hole, and the auxiliary hole is covered with a damping structure.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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