Verfahren zur Herstellung einer Leiterplatte
Anmelder: Alps Alpine Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4734669
- Anmeldetag
- 17. Oktober 2025
- Veröffentlichung
- 29. April 2026
- Rechtsraum
- EP
- IPC
- (AHN JIYOUNG et al.)
Abstract
A method of manufacturing a circuit board is disclosed. The method includes: a first step of forming a plurality of pixel circuits on a film with the pixels connected to each other by a wiring pattern; a second step of processing the film to thin the film at least at a position between pixels, and singulating the film into individual pixel units such that the film is cut together with the wiring pattern at the position between the pixels; a third step of transferring a plurality of singulated pieces, each having a pixel circuit formed thereon, onto a flexible substrate; and a fourth step of forming a stretchable interconnect by depositing liquid metal between wiring patterns cut in the second step.
Anmelder
- Firma
- Alps Alpine Co., Ltd.
- Land
- 🇯🇵 Japan
Japanischer Elektronikkonzern, Hersteller von elektronischen Bauteilen, Sensoren und Bediensystemen für Automobil-, Kommunikations- und Konsumelektronikanwendungen.
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