Gehäuse und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4734675

Anmeldetag

27. Februar 2024

Veröffentlichung

20. Februar 2025

Rechtsraum

EP

IPC

H05K5/02

Abstract

This application provides a housing and an electronic device. The housing includes a frame body and an overmolded part. A first mounting frame of the frame body is provided with a first mounting groove, and a first sidewall of the first mounting groove is provided with a retention groove. A first convex rib of the first mounting frame is fixedly connected to the first sidewall, a side surface of the first convex rib is recessed inwardly toward the first convex rib, and a first limiting groove is formed between the side surface of the first convex rib and the first sidewall. A second mounting frame of the overmolded part includes a second sidewall, the second sidewall is provided with a first groove, and a sidewall of the first groove is provided with a first engagement part. A protrusion of the overmolded part is fixedly connected to the second sidewall. The overmolded part is formed on the frame body, the first convex rib is located in the first groove, the first engagement part is located in the first limiting groove, and is engaged with the first limiting groove in a direction perpendicular to the first sidewall, and the protrusion is located in the retention groove, and is engaged with the retention groove in a width direction of the first sidewall. The housing provided in this application may be used to resolve a technical problem in the conventional technology that the overmolded part of the housing of the electronic device is prone to be separated from the frame body.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China

Fachgebiete