Wärmeleitende Struktur
EP4734680
2. Januar 2025
Anmelder: NOK Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4734680
- Anmeldetag
- 19. Juni 2024
- Veröffentlichung
- 2. Januar 2025
- Rechtsraum
- EP
Abstract
A heat conduction structure (1) includes a soft thermally conductive member (10) that is a soft member with thermally conductive properties. The soft thermally conductive member (10) is a member able to maintain a shape. The soft thermally conductive member (10) is packed between the heat-dissipating member (2) and the receiving member (3) .
Anmelder
- Firma
- NOK Corporation
- Land
- 🇯🇵 Japan
🇯🇵
NOK Corporation
Japanisches Unternehmen, das Dichtungen, Elastomerbauteile und elektronische Komponenten vor allem für die Automobilindustrie fertigt.
1.280 Patente in unserer Datenbank