Gehäusestruktur und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4734681

Anmeldetag

25. Juni 2024

Veröffentlichung

2. Januar 2025

Rechtsraum

EP

IPC

H05K7/20, H01L23/34, H01L23/36

Abstract

Provided is a housing structure, which accommodates heat-generating components, that can effectively dissipate heat generated by the heat-generating components, is light in weight, and can be easily manufactured. The housing structure of the present invention includes a housing containing a heat-dissipating resin, and a heat-generating component accommodated in the housing. The housing has a partition wall portion that is integrally formed by resin molding on an inner surface thereof toward the heat-generating component and that is configured to surround the heat-generating component, and a part surrounded by the partition wall portion and the housing serves as a heat-generating component accommodation portion capable of accommodating the heat-generating component. A thermally conductive grease is interposed between opposed surfaces of the heat-generating component and the partition wall portion within the heat-generating component accommodation portion.

Anmelder

Firma

Sekisui Chemical Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete