Komponentenmontagevorrichtung und Komponentenmontageverfahren

Details

Veröffentlichungs-Nr.

EP4734691

Anmeldetag

21. Juni 2023

Veröffentlichung

26. Dezember 2024

Rechtsraum

EP

IPC

H05K13/00

Abstract

A component mounter includes: a board conveyance device configured to convey a board and position the board at a predetermined work position; a carrier member on which a strip-shaped carrier tape in which components to be mounted on the board are respectively accommodated in multiple cavities arranged in a row and a tray in which the components are respectively accommodated in multiple accommodation portions arranged in a grid pattern are placed, the carrier member being disposed inside the component mounter; and a component transfer device configured to pick up the component from the carrier member and mount the picked-up component on the board positioned at a work position.

Anmelder

Firma

Fuji Corporation

Land

🇯🇵 Japan

Fachgebiete