Wärmeableitungsanordnung
Anmelder: Industrial Technology Research Institute 🇹🇼
Details
- Veröffentlichungs-Nr.
- EP4734740
- Anmeldetag
- 20. Oktober 2025
- Veröffentlichung
- 29. April 2026
- Rechtsraum
- EP
- IPC
- H10W40/22, H10W40/73
Abstract
A heat dissipation assembly (10, 10a, 10b, 10c, 10d, 10e, 10f, 10g) including first chamber (100, 100a, 100d, 100e, 100g), connecting chambers (200), first heat sinks (300) and second chamber (500, 500b, 500d, 500e). The first chamber has thermal contact surface (131, 131d) and first inner space (S1). The thermal contact surface is in thermal contact with heat source (20, 20c, 20d). The connecting chambers each include at least one communicating channel (210) in fluid communication with the first inner space. The first heat sinks are disposed between the connecting chambers, respectively. The second inner space (S2, S2b) is in fluid communication with the first inner space via communicating channel. A normal direction (N) of the thermal contact surface is parallel to extending direction (E) of communicating channel of connecting chambers. The communicating channel is entirely located between first and second inner spaces.
Anmelder
- Firma
- Industrial Technology Research Institute
- Land
- 🇹🇼 Taiwan
Taiwanisches Forschungsinstitut für angewandte Technologie, entwickelt und überträgt Innovationen aus Elektronik, Materialwissenschaft und Industrietechnik in die Wirtschaft.
734 Patente in unserer Datenbank