Wärmeableitungsanordnung

EP4734740 29. April 2026

Anmelder: Industrial Technology Research Institute 🇹🇼

Details

Veröffentlichungs-Nr.
EP4734740
Anmeldetag
20. Oktober 2025
Veröffentlichung
29. April 2026
Rechtsraum
EP
IPC
H10W40/22, H10W40/73
Offizieller Volltext

Abstract

A heat dissipation assembly (10, 10a, 10b, 10c, 10d, 10e, 10f, 10g) including first chamber (100, 100a, 100d, 100e, 100g), connecting chambers (200), first heat sinks (300) and second chamber (500, 500b, 500d, 500e). The first chamber has thermal contact surface (131, 131d) and first inner space (S1). The thermal contact surface is in thermal contact with heat source (20, 20c, 20d). The connecting chambers each include at least one communicating channel (210) in fluid communication with the first inner space. The first heat sinks are disposed between the connecting chambers, respectively. The second inner space (S2, S2b) is in fluid communication with the first inner space via communicating channel. A normal direction (N) of the thermal contact surface is parallel to extending direction (E) of communicating channel of connecting chambers. The communicating channel is entirely located between first and second inner spaces.

Anmelder

Firma
Industrial Technology Research Institute
Land
🇹🇼 Taiwan
🇹🇼 Industrial Technology Research Institute

Taiwanisches Forschungsinstitut für angewandte Technologie, entwickelt und überträgt Innovationen aus Elektronik, Materialwissenschaft und Industrietechnik in die Wirtschaft.

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