Anordnung mit Optoelektronischen Bauelementen zur Datenübertragung und Verfahren zu deren Herstellung

Details

Veröffentlichungs-Nr.

EP4737962

Anmeldetag

4. November 2024

Veröffentlichung

6. Mai 2026

Rechtsraum

EP

IPC

(BADCOCK THOMAS JAMES et al.)(UNIV SHENZHEN et al.)

Abstract

An assembly comprisinga a first sub-assembly comprisingi. a first layer of a first kind comprising a first plurality of electronic components;ii. a first plurality of waveguides;iii. a first plurality of opto-electronic components that each has a height that is equal to or less than 50 μm and are adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides;iv. a first plurality of connectors, whereinA. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component with at least one opto-electronic component;wherein an average lateral minimum distance F_X between the first longitudinal portions and the first plurality of connectors is in the range from 0.75 to 1.7 µm.

Anmelder

Firma

Black Semiconductor GmbH

Land

🇩🇪 Deutschland