Antennenelement, Antennenarray und Antennenmodul
Anmelder: Sony Semiconductor Solutions Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4738609
- Anmeldetag
- 19. Juni 2024
- Veröffentlichung
- 2. Januar 2025
- Rechtsraum
- EP
- IPC
- H01Q9/42, H01Q1/52, H01Q21/06
Abstract
[Object] Provided are an antenna element, an antenna array, and an antenna module that are capable of achieving miniaturization and a wider bandwidth with a simple structure. [Solving Means] An antenna element according to an embodiment of the present technology includes a first conductor layer having a planar element shape, a second conductor layer, a dielectric layer, a first interlayer connection portion, and a second interlayer connection portion. The second conductor layer is connected to a ground potential. The dielectric layer is provided between the first conductor layer and the second conductor layer. The first interlayer connection portion penetrates the dielectric layer and connects the first conductor layer to a power feed portion. The second interlayer connection portion penetrates the dielectric layer and connects the first conductor layer and the second conductor layer.
Anmelder
- Firma
- Sony Semiconductor Solutions Corporation
- Land
- 🇯🇵 Japan
Japanisches Halbleiterunternehmen mit Sitz in Atsugi, eine Tochtergesellschaft der Sony Group. Das Unternehmen entwickelt Bildsensoren, CMOS-Sensoren und Halbleiterlösungen für Kameras, Smartphones, Automobile und industrielle Anwendungen.
6.194 Patente in unserer Datenbank