Verfahren zur Vorablötung und Vorrichtung zur Vorablötung

Details

Veröffentlichungs-Nr.

EP4741088

Anmeldetag

5. Juni 2024

Veröffentlichung

27. März 2025

Rechtsraum

EP

IPC

B23K1/20, B23K1/005

Abstract

A pre-solder formation method is a method for forming pre-solder on an aluminum electrode formed of aluminum. The pre-solder formation method includes a placement step of placing solder on the aluminum electrode, and a joining step of joining the solder to the aluminum electrode by melting and solidifying the solder using a laser beam. In the joining step, the laser beam is irradiated so that an amount of energy of the laser beam irradiated to the aluminum electrode is larger than an amount of energy of the laser beam irradiated to the solder.

Anmelder

Firma

Hamamatsu Photonics K.K.

Land

🇯🇵 Japan