Elektrodenplattenschlitzvorrichtung und Elektrodenplattenschlitzverfahren damit

Details

Veröffentlichungs-Nr.

EP4741122

Anmeldetag

10. September 2025

Veröffentlichung

13. Mai 2026

Rechtsraum

EP

IPC

B26D1/24, B26D7/26(TOYOTA MOTOR CORP et al.)

Abstract

An electrode plate slitting apparatus includes a first cutting unit configured to cut a supplied electrode plate raw material into a plurality of split electrode plates, a second cutting unit configured to cut the plurality of split electrode plates, a sensor unit configured to detect the plurality of split electrode plates supplied to the second cutting unit, resulting in detected split electrode plates, and a control unit configured to receive information about the detected split electrode plates, and control driving of the second cutting unit.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea

Fachgebiete