Drehwellenmechanismus und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4741672

Anmeldetag

5. August 2024

Veröffentlichung

15. Mai 2025

Rechtsraum

EP

IPC

F16C11/04, H05K5/02

Abstract

This application provides a hinge mechanism and an electronic device, and relates to the technical field of electronic products, to ensure structural strength of a connecting portion between a swing arm and a hinge base while satisfying a demand for overall thinning of the device. The hinge mechanism includes a hinge base and a first swing arm. The hinge base includes a first mating portion, a second mating portion, and a third mating portion sequentially disposed along an extension direction of a hinge axis. A front side surface of the first mating portion is a first concave arc surface, a rear side surface of the second mating portion is a first convex arc surface, and a front side surface of the third mating portion is a second concave arc surface. The first swing arm includes a fourth mating portion, a fifth mating portion, and a sixth mating portion, the fourth mating portion is located on a front side of the first mating portion, the fifth mating portion is located on a rear side of the second mating portion, and the sixth mating portion is located on a front side of the third mating portion. The fourth mating portion, the fifth mating portion, and the sixth mating portion are slidable respectively along the first concave arc surface, the first convex arc surface, and the second concave arc surface, so that the first swing arm is rotatable relative to the hinge base around the hinge axis.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China