Radarkomponente

Details

Veröffentlichungs-Nr.

EP4741870

Anmeldetag

7. November 2024

Veröffentlichung

13. Mai 2026

Rechtsraum

EP

IPC

G01S7/02, G01S7/03, H01P5/107(KISHIMA KOICHIRO et al.)

Abstract

An exemplary embodiment of the invention relates to a radar component (1) comprising an electric circuit board (5) having a patterned electrical layer (10), a chip (15) comprising an electronic-photonic-integrated circuit which is mounted on a top surface (5a) of the circuit board (5) and electrically connected to electrical traces (20) formed by sections of the electrical layer (10), at least one optical fiber (25) being butt-coupled to an assigned optical waveguide (30) integrated in the chip (15), the core of the butt-coupled end of the fiber (25) lying in the same plane (P) as the optical waveguide (30), said plane (P) being parallel to the said top surface (5a) of the circuit board (5), wherein the alignment between the fiber (25) and the optical waveguide (30) provides a straight, linear transmission of optical radiation between the optical fiber (25) and the optical waveguide (30), at least one radar antenna pad (35) formed by a metal pad of the electrical layer (10) or a metal pad of another electrical layer (100) of the circuit board (5), wherein the radar antenna pad (35) is connected to the chip (15) via at least one of said traces (20), and a microwave waveguide formed by a hollow pipe (45) and coupled to said radar antenna pad (35), wherein the fiber (25) is mechanically carried by a groove of the chip (15) which aligns the core of the fiber (25) with the assigned optical waveguide (30), and wherein a longitudinal axis of the hollow pipe (45) is angled to said plane (P), at least in the vicinity of the radar antenna pad (35).

Anmelder

Firma

Xavveo GmbH

Land

🇩🇪 Deutschland