Photonisches Produkt zur Chipkopplung auf Gleicher Ebene, das bei Kryogenen Temperaturen Arbeitet, und Herstellungsverfahren dafür

Details

Veröffentlichungs-Nr.

EP4741894

Anmeldetag

11. November 2024

Veröffentlichung

13. Mai 2026

Rechtsraum

EP

IPC

G02B6/12, G02B6/122, G02B6/30(BROWN GORDON C et al.)

Abstract

The present application pertains to a photonic in-plane chip coupling product including a support with a first and a second stack, each comprising a carrier and an optical component. The first stack has a carrier with a mounting surface and an opposing carrier surface carrying the first optical component, which has a first guided optical mode. Likewise, the second stack has a carrier and an optical component, featuring a second guided optical mode. These stacks are aligned so that the centers of their respective mode field distributions coincide. To minimize thermal deformation, at least one carrier in each stack includes layers of different materials with mutually different thermal expansion coefficients. Therewith a total thermal deformation between the mounting surfaces and the centers of the mode field distributions is minimized.

Anmelder

Firma

Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Land

🇳🇱 Niederlande