Elektronische Vorrichtung

EP4741898 13. Mai 2026

Anmelder: Japan Aviation Electronics Industry, Limited 🇯🇵

Details

Veröffentlichungs-Nr.
EP4741898
Anmeldetag
2. September 2025
Veröffentlichung
13. Mai 2026
Rechtsraum
EP
IPC
G02B6/42, G06F1/20, H05K7/20
Offizieller Volltext

Abstract

A heat sink (heat conductive sheet) is pressed against a plug shell without sliding on the plug shell. In an electronic device 10, a heat sink 51 is supported to be movable in a first direction and a second direction relative to a receptacle shell 61. First pressing means 63 pressing the heat sink 51 in a positive first direction relative to the receptacle shell 61, and second pressing means 64 pressing the heat sink 51 in a negative second direction relative to the receptacle shell 61 are disposed. The receptacle shell 61 includes a guide portion (cam groove 62). The heat sink 51 includes a guided portion (columnar protrusion 57) guided by the guide portion (cam groove 62). The heat sink 51 and a plug connector 20 respectively include abutting surfaces 55 and 25 abutting on each other in the first direction when the plug connector 20 is inserted into an opening 42 of a receptacle housing 41.

Anmelder

Firma
Japan Aviation Electronics Industry, Limited
Land
🇯🇵 Japan
🇯🇵 Japan Aviation Electronics Industry

Japanischer Hersteller elektronischer Steckverbinder und Sensoren mit Sitz in Tokio, mehrheitlich im Besitz des Elektronikkonzerns Alps Alpine.

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