Elektronische Vorrichtung
Anmelder: Japan Aviation Electronics Industry, Limited 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4742846
- Anmeldetag
- 12. August 2025
- Veröffentlichung
- 13. Mai 2026
- Rechtsraum
- EP
- IPC
- H05K7/20, G02B6/42, G06F1/20(OKI KAZUSHIGE et al.)
Abstract
There is provided a technique for bringing a heat sink and a plug shell into contact with each other without causing the heat sink and the plug shell to slide on each other with a simple configuration. In an electronic device 10, a heat sink 51 is supported to be movable in a first direction relative to a receptacle shell 61. A contact surface 25 of a plug shell 21 and a heat releasing surface of the heat sink 51 are formed as inclined surfaces. Pressing means 63 is disposed between the heat sink 51 and the receptacle shell 61. The receptacle shell 61 includes a guide portion (cam groove 62) configured to regulate movement of the heat sink 51 in a negative second direction when the heat sink 51 is at a position in a positive first direction relative to the receptacle shell 61, and to regulate movement of the heat sink 51 in a positive second direction when the heat sink 51 is at a position in a negative first direction relative to the receptacle shell 61. The heat sink 51 includes a guided portion (columnar protrusion 57) configured to be guided by the guide portion (cam groove 62) provided on the receptacle shell 61.
Anmelder
- Firma
- Japan Aviation Electronics Industry, Limited
- Land
- 🇯🇵 Japan
Japanischer Hersteller elektronischer Steckverbinder und Sensoren mit Sitz in Tokio, mehrheitlich im Besitz des Elektronikkonzerns Alps Alpine.
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