Verfahren zum Zerteilen eines Halbleiterwafers

Details

Veröffentlichungs-Nr.

EP4746035

Anmeldetag

15. November 2024

Veröffentlichung

20. Mai 2026

Rechtsraum

EP

Abstract

A method of dicing a semiconductor wafer comprises steps of a) positioning a stencil mask over the semiconductor wafer, with the stencil mask being spaced from the semiconductor wafer by a gap such that the stencil mask does not touch a component arranged on the semiconductor wafer, the stencil mask having an aperture; and b) subsequently etching through the semiconductor wafer by performing a reactive ion etch, wherein the stencil mask controls the etch. The method may allow a wafer to be diced without the use of die attach tape and without need for a cleaning step, and may be useful for dicing wafers bearing microelectromechanical systems. Also provided are a stencil mask and system useful in the method.

Anmelder

Firma

Microsoft Technology Licensing, LLC

Land

🇺🇸 USA