Schutzschaltungsmodul und Batteriepack

Details

Veröffentlichungs-Nr.

EP4746109

Anmeldetag

13. November 2025

Veröffentlichung

20. Mai 2026

Rechtsraum

EP

IPC

H01M10/42, H05K1/16, H05K1/18

Abstract

Embodiments of the present disclosure relates to a protection circuit module, and the technical problem to be solved is to provide a protection circuit module capable of dissipating heat. To this end, embodiments of the present disclosure provides a protection circuit module including a substrate, a circuit pattern disposed on the substrate, and an insulating layer provided on the substrate while covering the circuit pattern, wherein the insulating layer includes one or more holes formed on at least a portion of the circuit pattern.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea