Schutzschaltungsmodul und Akkupack

Details

Veröffentlichungs-Nr.

EP4746588

Anmeldetag

13. November 2025

Veröffentlichung

20. Mai 2026

Rechtsraum

EP

Abstract

Embodiments of the present disclosure relates to a protection circuit module, and the technical problem to be solved is to provide a protection circuit module capable of dissipating heat. To this end, embodiments of the present disclosure provides a protection circuit module including a substrate, a circuit pattern disposed on the substrate, and an insulating layer provided on the substrate while covering the circuit pattern, wherein the insulating layer includes an opening formed on a side of at least a portion of the circuit pattern.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea