Harzzusammensetzung, Prepreg, Harzfolie, Laminat, Leiterplatte und Halbleitergehäuse
Anmelder: Resonac Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4748892
- Anmeldetag
- 1. Juli 2024
- Veröffentlichung
- 30. Januar 2025
- Rechtsraum
- EP
Abstract
Provided is a resin composition and the like, which exhibits low transmission loss and excellent flame retardancy, and is capable of improving the appearance of a laminate. The resin composition is, specifically as follows. A resin composition containing: (A) a thermosetting resin; (B) a polymer having a hydrocarbon chain or a polyether chain; (X) a phosphorus compound-based flame retardant; and (Y) a flame retardant other than the phosphorus compound-based flame retardant, in which the component (X) does not contain (X1) a filler-type flame retardant, and the component (Y) does not contain (Y1) a filler-type flame retardant, or, in which when the component (X) contains the filler-type flame retardant (X1) or the component (Y) contains the filler-type flame retardant (Y1), a total content of the filler-type flame retardant (X1) and the filler-type retardant (Y1) is 25 parts by mass or less with respect to 100 parts by mass of the solid content in the resin composition.
Anmelder
- Firma
- Resonac Corporation
- Land
- 🇯🇵 Japan
Japanischer Chemiekonzern mit Sitz in Tokio, hervorgegangen aus Showa Denko. Das Unternehmen stellt unter anderem Halbleitermaterialien, Elektronikchemikalien und funktionale Chemieprodukte her.
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Vertreten von
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Hoffmann Eitle
Hoffmann Eitle · München