Verfahren zum Anbringen eines Filmhaftmaterials und Vorrichtung zum Anbringen eines Filmhaftmaterials
Anmelder: Resonac Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4748896
- Anmeldetag
- 22. März 2024
- Veröffentlichung
- 23. Januar 2025
- Rechtsraum
- EP
Abstract
A film adhesive material affixing method includes a step of wrapping one film adhesive material over one end face and both plate surfaces of a heated plate member extending in one direction, a step of pressing the one film adhesive material against both of the plate surfaces, a step of pressing the one film adhesive material against the one end face, a step of wrapping another film adhesive material over another end face and both of the plate surfaces of the heated plate member and overlapping the other film adhesive material and the one film adhesive material on both of the plate surfaces, a step of pressing the other film adhesive material against both of the plate surfaces, and a step of pressing the other film adhesive material against the other end face.
Anmelder
- Firma
- Resonac Corporation
- Land
- 🇯🇵 Japan
Japanischer Chemiekonzern mit Sitz in Tokio, hervorgegangen aus Showa Denko. Das Unternehmen stellt unter anderem Halbleitermaterialien, Elektronikchemikalien und funktionale Chemieprodukte her.
794 Patente in unserer Datenbank
Vertreten von
-
Berggren Oy
Berggren Oy · Helsinki