Klebefolie
Anmelder: Nitto Denko Corporation 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4748899
- Anmeldetag
- 11. März 2024
- Veröffentlichung
- 30. Januar 2025
- Rechtsraum
- EP
Abstract
Provided is a pressure-sensitive adhesive sheet, which contains thermally expandable microspheres and can exhibit peeling properties under heating, and in which a change in thickness and a change in surface roughness are suppressed even at a high temperature that does not require peeling. The pressure-sensitive adhesive sheet according to one embodiment of the present invention includes in this order: a base material; a resin layer; and a first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer contains thermally expandable microspheres, and a thickness deformation initiation temperature Tf (°C) of the pressure-sensitive adhesive sheet by TMA and a gasification initiation temperature Tgas (°C) of the thermally expandable microspheres by EGA/MS have a relationship of Tf≥Tgas-10.
Anmelder
- Firma
- Nitto Denko Corporation
- Land
- 🇯🇵 Japan
Japanisches Materialwissenschafts- und Chemieunternehmen mit Sitz in Osaka. Nitto Denko entwickelt Klebebänder, Folien, optische Materialien für Displays sowie Membranen und Materialien für Elektronik, Automobil und Medizintechnik.
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