Antennenfeder und Elektronische Vorrichtung
Anmelder: Honor Device Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4749831
- Anmeldetag
- 2. August 2024
- Veröffentlichung
- 8. Mai 2025
- Rechtsraum
- EP
- IPC
- H01R4/02, H01Q1/22
Abstract
This application provides an antenna spring and an electronic device, which can reduce mounting space of the antenna spring and improve space utilization in the electronic device, thereby facilitating miniaturization design of the electronic device. The electronic device includes a frame, an antenna spring, a circuit board, and an electrically conductive elastic piece. The antenna spring, the circuit board, and the electrically conductive elastic piece are all mounted on an inner side of the frame. The frame includes a frame antenna, the antenna spring is located between the frame antenna and the circuit board, and the antenna spring includes a fastening portion, an abutting portion, and a connecting portion. The fastening portion and the abutting portion are both fixedly connected to the connecting portion, the fastening portion is fixedly connected to the frame antenna, and a projection of the abutting portion on the connecting portion is spaced from the fastening portion. The electrically conductive elastic piece is mounted on a side that is of the circuit board and that faces the antenna spring, and abuts against the abutting portion.
Anmelder
- Firma
- Honor Device Co., Ltd.
- Land
- 🇨🇳 China
Chinesisches Unternehmen der Unterhaltungselektronik mit Sitz in Shenzhen, hervorgegangen aus Huawei. Entwickelt und vertreibt Smartphones sowie weitere mobile und vernetzte Endgeräte.
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