Leiterplattenanordnung zur Definition eines Durchgangslochs und Elektronische Vorrichtung damit

Details

Veröffentlichungs-Nr.

EP4750230

Anmeldetag

2. September 2025

Veröffentlichung

9. April 2026

Rechtsraum

EP

Abstract

An electronic device includes a first PCB, a second PCB, an interposer disposed between a first peripheral portion of the first PCB and a second peripheral portion of the second PCB, and one or more electronic components disposed in an internal space defined by a rear side of the first PCB, a front side of the second PCB, and an inner side of the interposer. The first PCB defines a first through hole positioned in the first peripheral portion, and the interposer defines a second through hole connected to the first through hole.

Anmelder

Firma

SAMSUNG ELECTRONICS CO., LTD.

Land

🇰🇷 Südkorea