Wärmeableitungsanordnung

Details

Veröffentlichungs-Nr.

EP4750237

Anmeldetag

27. Mai 2024

Veröffentlichung

3. April 2025

Rechtsraum

EP

IPC

H05K7/20

Abstract

Provided in the present application is a heat dissipation assembly, which is applied to an electronic device, the electronic device comprising a first substrate and a second substrate arranged opposite to the first substrate, and first components on the first substrate being connected to second components of the second substrate by means of connectors. The heat dissipation assembly comprises a heat dissipation substrate and through hole structures. The heat dissipation substrate is in contact with the first substrate, is used for dissipating heat of the first substrate and is provided with through holes corresponding to the connectors. Each through hole structure comprises a hole pillar corresponding to a through hole, a first sealing cover extending from one end of the hole pillar and a second sealing cover extending from the other end of the hole pillar, the connectors being connected to the first components and the second components by means of the through holes and the hole pillars. Each first sealing cover hermetically coats the connecting area of a connector and a first component, and each second sealing hermetically coats the connecting area of a connector and a second component.

Anmelder

Firma

ZTE CORPORATION

Land

🇨🇳 China