Elektrodenplattenkerbungsvorrichtung und Verfahren zum Kerben einer Elektrodenplatte
Anmelder: SAMSUNG SDI CO., LTD. 🇰🇷
Details
- Veröffentlichungs-Nr.
- EP4751869
- Anmeldetag
- 25. November 2025
- Veröffentlichung
- 3. Juni 2026
- Rechtsraum
- EP
Abstract
The present invention relates to an electrode plate notching apparatus and a method of notching an electrode, and an object thereof is to prevent generation of threads or burrs in a notching process. An electrode plate notching apparatus (1) according to embodiments includes a lower body (100) which supports an electrode plate (10) transferred in a first direction, a die (300) installed on the lower body (100) to face a non-coating portion of the electrode plate (10) and including a punch hole (400), an upper body (200) installed above the lower body (100) to be movable upwardly and downwardly, a punch (500) installed on the upper body (200) to ascend and descend in conjunction with ascent and descent of the upper body (200) and inserted into the punch hole (400) as the upper body (200) descends, and a tension application member (600) which applies tension to the electrode plate (10) in a second direction intersecting the first direction before the punch (500) is inserted into the punch hole (400).
Anmelder
- Firma
- SAMSUNG SDI CO., LTD.
- Land
- 🇰🇷 Südkorea
Südkoreanisches Unternehmen der Samsung-Gruppe, das Batterien und Energiespeichersysteme für Elektrofahrzeuge, Elektronikgeräte und stationäre Anwendungen entwickelt und produziert.
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