Spulenmodul, Elektronische Vorrichtung und Drahtloses Ladesystem

Details

Veröffentlichungs-Nr.

EP4752917

Anmeldetag

27. Dezember 2024

Veröffentlichung

17. Juli 2025

Rechtsraum

EP

IPC

H01F27/28

Abstract

This application provides a coil module, an electronic device, and a wireless charging system, and relates to the field of wireless charging technologies, to resolve a problem that a relatively thick wireless charging coil module in the conventional technology is not conducive to disposing another functional component in the electronic device. The coil module includes a coil structure. The coil structure includes a functional layer, and in a thickness direction of the coil structure, the functional layer includes a first wiring sublayer, a second wiring sublayer, and an insulation sublayer located between the first wiring sublayer and the second wiring sublayer. The coil structure further includes a first end, a second end, and a plurality of coil groups sequentially connected in series. The first end and the plurality of coil groups are disposed in the first wiring sublayer, and an outermost coil group is connected to the first end. The second end is disposed in the second wiring sublayer. A via hole is disposed in the insulation sublayer, and a connection structure is disposed in the via hole. An innermost coil group is connected to the second end through the connection structure in the insulation sublayer, so that the first end is electrically connected to the second end through the plurality of coil groups sequentially connected in series.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China