Hintere Endkappenanordnung, Herstellungsform und Verbinder
Anmelder: Tyco Electronics (Shanghai) Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4753081
- Anmeldetag
- 26. November 2025
- Veröffentlichung
- 3. Juni 2026
- Rechtsraum
- EP
Abstract
The present invention discloses a rear end cover assembly, a manufacturing mold, and a connector. The rear end cover assembly is used for installation onto the rear end of a connector housing. The rear end cover assembly (100) comprises: a rear end cover (1) comprising an end wall (11) and a peripheral wall (12) that enclose an inner cavity (10), and an opening opposite to the end wall (11); and a sealing element (3) which is formed by a sealant (3') poured into the inner cavity (10) of the rear end cover (1). A slot hole (17) is formed in the end wall (11) to allow a cable of a connector to pass through, and a cable through-hole (30) is formed in the sealing element (3) to allow the cable to pass through, the cable through-hole (30) is suitable for interference fit with the cable to achieve sealing between the two. Before pouring the sealant (3'), the rear end cover (1) is fixed to a manufacturing mold (2) with the opening facing upwards, and a pin (22) on the manufacturing mold (2) extends into the inner cavity (10) of the rear end cover (1) through the slot hole (17) for forming the cable through-hole (30). The present invention can improve manufacturing efficiency and enhance sealing performance.
Anmelder
- Firma
- Tyco Electronics (Shanghai) Co., Ltd.
- Land
- 🇨🇳 China
Der Anmelder ist eine chinesische Gesellschaft aus dem Tyco-Electronics-Konzern, der Vorläuferorganisation des heutigen TE-Connectivity-Konzerns, mit Fertigungs- und Entwicklungsstandort in Shanghai. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Optik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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