Modulares Halbfertiges Verdrahtungsprodukt, Verdrahtungsmodul und Verdrahtungskomponente

Details

Veröffentlichungs-Nr.

EP4753378

Anmeldetag

29. November 2024

Veröffentlichung

3. Juni 2026

Rechtsraum

EP

Abstract

The disclosure describes a semi-finished wiring product (100) comprising a first conductor track layer (120) and a second conductor track layer (140). The first conductor track layer (120) has a plurality of first conductor track arrangements (122) extending parallel to one another. The second conductor track layer (140) is arranged on a surface of the first conductor track layer (120) and has a plurality of second conductor track arrangements (142) extending parallel to one another. The arrangement is such that at least one of the second conductor track arrangements (142) intersects one of the first conductor track arrangements (122). Furthermore, an outer surface (146) of the second conductive track layer (120) has a contact surface (148) in at least one intersection region, at which one of the first conductive track arrangements (122) intersects with one of the second conductive track arrangements (142), which is electrically conductively connected to the first and second conductive track arrangements (122, 142) located in the intersection region. The first conductive track arrangements (122) and the second conductive track arrangements (142) further comprise a first conductive track (122A, 142A) electrically connected to each contact surface (148) arranged along its course. Furthermore, the first conductor track arrangements (122) and/or the second conductor track arrangements (148) each comprise a second conductor track (122B, 142B) which is electrically connected to at most every second contact surface (148) arranged along its course.

Anmelder

Firma

Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Land

🇩🇪 Deutschland