Verfahren zur Herstellung einer Schaltungsmusteranordnung mit Trennfolie, Verfahren zur Herstellung einer Leiterplatte und Schaltungsmusteranordnung mit Trennfolie

Details

Veröffentlichungs-Nr.

EP4753382

Anmeldetag

13. Juni 2024

Veröffentlichung

30. Januar 2025

Rechtsraum

EP

IPC

H05K3/20

Abstract

Provided is a method for producing a release film-attached circuit-pattern aggregate that enables prevention of a defect due to etching from a front face. Provided is a method for producing a release film-attached circuit-pattern aggregate, a circuit-pattern aggregate (2) including a dummy pattern (4) disposed in a gap (G) located between a plurality of circuit patterns (3) and a first gap (G1) located between the dummy pattern (4) and each circuit pattern (3), the method including: a step of providing, to a back face of a metal plate (9), a first back-face recess (G1R) corresponding to the first gap (G1) and a second back-face recess (G2R) corresponding to a second gap (G2) located between conductive patterns (3a); a step of applying a release film (5) to adhere to the back face of the metal plate (9) provided with the first back-face recess (G1R) and the second back-face recess (G2R); and a step of removing, by etching, a first portion corresponding to the first back-face recess (G1R) and a second portion corresponding to the second back-face recess (G2R) on a front face of the metal plate (9).

Anmelder

Firma

NHK Spring Co., Ltd.

Land

🇯🇵 Japan