Harzzusammensetzung, Prepreg, Laminierte Platte, Metallkaschierte Laminierte Platte, Leiterplatte und Halbleitergehäuse

Details

Veröffentlichungs-Nr.

EP4755974

Anmeldetag

29. Juli 2024

Veröffentlichung

6. Februar 2025

Rechtsraum

EP

Abstract

Provided is a resin composition containing an acrylic polymer serving as a combustible component, the resin composition having excellent flame resistance with satisfactory adhesion strength to a copper foil and desmear resistance maintained. Further, a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition are provided. The resin composition is specifically a resin composition containing an acrylic polymer (A), a thermosetting resin (B), and an inorganic filler (C) surface-treated with a silane coupling agent, further containing a silane coupling agent (D).

Anmelder

Firma

Resonac Corporation

Land

🇯🇵 Japan