Festkörperquantensensormodul und Sensorvorrichtung
Anmelder: Dai Nippon Printing Co., Ltd. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4756470
- Anmeldetag
- 28. Juni 2024
- Veröffentlichung
- 2. Januar 2025
- Rechtsraum
- EP
Abstract
The present disclosure provides a solid-state quantum sensor module comprising: a substrate including a first main surface and a second main surface located on an opposite side to the first main surface; a solid-state element, including a color center, located on a first main surface side of the substrate; a light guide plate located between the substrate and the solid-state element; a microwave field-transmitting antenna; a light source located on the first main surface side of the substrate and emits light including a first wavelength that excites the color center from a ground state to an excited state; and a light detector located on the first main surface side of the substrate and detects photoluminescence including a second wavelength emitted from the solid-state element, wherein, when viewed along a normal direction of the first main surface of the substrate, the solid-state element overlaps with the microwave field-transmitting antenna; and when viewed along the normal direction of the first main surface of the substrate, the light detector does not overlap with the microwave field-transmitting antenna.
Anmelder
- Firma
- Dai Nippon Printing Co., Ltd.
- Land
- 🇯🇵 Japan
Japanisches Unternehmen der Druckindustrie mit Sitz in Tokio, das sich über klassische Druckerzeugnisse hinaus in Elektronikmaterialien, Displaykomponenten und Verpackungslösungen diversifiziert hat.
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