Optisches Modul

Details

Veröffentlichungs-Nr.

EP4756509

Anmeldetag

13. Juni 2024

Veröffentlichung

6. Februar 2025

Rechtsraum

EP

IPC

G02B6/44

Abstract

An optical module includes: a circuit board provided with an optical chip; a lens assembly covered on the optical chip, where a first seal exists between the lens assembly and the circuit board and is located on an outer side wall of the lens assembly and a surface of the circuit board, one end of the lens assembly is provided with a wrapping cavity, the lens assembly is provided with a recessed optical port groove and a blocking assembly that is at least partially covered on the optical port groove to prevent coolant from seeping into the optical port groove, and the optical port groove has a reflective surface configured to reflect an optical signal; and an optical fiber holder fixedly connected to an optical fiber at one end and fixed in the wrapping cavity at the other end, where a first end face of the optical fiber holder is embedded in the wrapping cavity, and a second seal exists between the optical fiber holder and the wrapping cavity and is located between respective side faces of the optical fiber holder and outer side faces of three side walls of the wrapping cavity away from the circuit board, and around a side wall of the wrapping cavity close to the circuit board.

Anmelder

Firma

Hisense Broadband Multimedia Technologies Co., Ltd.

Land

🇨🇳 China

Fachgebiete