Kollektivplatte, Verfahren zur Herstellung davon und Verfahren zur Herstellung einer Leiterplatte

Details

Veröffentlichungs-Nr.

EP4757497

Anmeldetag

9. April 2024

Veröffentlichung

6. Februar 2025

Rechtsraum

EP

IPC

H05K1/02, H05K1/05, H05K3/00

Abstract

Provided is a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are juxtaposed in a lattice shape. The collective board is provided with a product portion 3 in which a plurality of circuit boards 17 having a circuit pattern 15 on an insulating substrate 13 are juxtaposed in a first direction and a second direction intersecting each other in a lattice shape, a slit 7 spanning between at least ends of the product portion 3 in the first direction and penetrating, in a thickness direction, a portion between the circuit boards 17 adjacent to each other in the second direction, a coupling portion 9 coupling the circuit boards 17 adjacent to each other in the second direction at least at one end of the product portion 3 in the first direction, and grooves 11 spanning between ends of the product portion 3 in the second direction, being located between the circuit boards 17 and the coupling portion 9 adjacent to each other in the first direction and between the circuit boards 17 adjacent to each other in the first direction, and non-penetrating in the thickness direction.

Anmelder

Firma

NHK Spring Co., Ltd.

Land

🇯🇵 Japan