Leiterplattenanordnung und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4757506

Anmeldetag

4. August 2025

Veröffentlichung

12. März 2026

Rechtsraum

EP

IPC

H05K1/14

Abstract

This application relates to the field of electronic device technologies, and in particular, to a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, an electrical connection board, and a flexible circuit board. The electrical connection board is mounted on the circuit board in a thickness direction of the circuit board assembly, and is electrically connected to the circuit board. At least a part of the flexible circuit board has a flexible structure. The flexible circuit board includes a first connection segment and a second connection segment. The first connection segment is configured to connect to a component of an electronic device. The second connection segment is connected to the electrical connection board. The electrical connection board is configured to adjust a distance between the second connection segment and the circuit board in the thickness direction of the circuit board assembly, to adjust a bent form of the flexible circuit board without changing a distance between the component of the electronic device and the circuit board in a width direction of the electronic device.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China