Verfahren zur Elektrischen Verbindung einer Ersten Leiterplatte mit einer Zweiten Leiterplatte

Details

Veröffentlichungs-Nr.

EP4757507

Anmeldetag

9. Dezember 2024

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

Abstract

The disclosure relates to a method for electrical connection of a first circuit board (110) to a second circuit board (120) by single-side welding or by double-side welding. A first circuit board and a second circuit board is provided, wherein at least one metal pad (311) of the first circuit board (110) is overlying at least one metal pad (311) of the second circuit board (120) when the first circuit board (110) is placed on top of the second circuit board (120). The single-side welding method comprises: electrically connecting (414) two leads (131, 132) of a welding machine (130) to a first part (312) and a second part (313) of the at least one metal pad (311) of the first circuit board (110); and welding the metal pad (311) of the first circuit board (110) to the metal pad (311) of the second circuit board (120) by activating a welding machine (130). The double-side welding method comprises: electrically connecting (424) two leads (131, 132) of a welding machine (130) to part of the at least one metal pad (311) on top of the first circuit board (110) and part of the at least one metal pad (311) on bottom of the second circuit board (120); and welding the metal pad (311) of the first circuit board (110) to the metal pad (311) of the second circuit board (120) by activating the welding machine (130).

Anmelder

Firma

Lisa Dräxlmaier GmbH

Land

🇩🇪 Deutschland