Wärmeaustauschvorrichtung und Verfahren für Kühlvorrichtungen mit Hoher Wärmefluxdichte, insbesondere Pcb

Details

Veröffentlichungs-Nr.

EP4757513

Anmeldetag

9. Dezember 2024

Veröffentlichung

10. Juni 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

The disclosure relates to a heat exchange device (100) for cooling a printed circuit board (110) comprising a plurality of electronic components (111, 112, 113), the heat exchange device (100) comprising: a hollow chamber (150) comprising a base plate (120), a top plate (110) and side walls (130, 131), wherein the top plate (110) is formed by the printed circuit board (110); wherein the base plate (120) comprises a plurality of cooling liquid inlets (141, 142, 143) which are configured to enable a passage of the coolant liquid (151) into the hollow chamber (150); wherein the plurality of cooling liquid inlets (141, 142, 143) are aligned towards the plurality of electronic components on the printed circuit board such that a respective cooling liquid inlet (141, 142, 143) is arranged below a corresponding electronic component (111, 112, 113) to enable the coolant passing through the respective cooling liquid inlet (141, 142, 143) to impinge at a part of the printed circuit board (110) where the corresponding electronic component (111, 112, 113) is attached to.

Anmelder

Firmen

Lisa Dräxlmaier GmbH
Silesian University of Technology

Land

🇩🇪 Deutschland

Fachgebiete