Integrierte Photonikvorrichtung, Zugehörige Schaltung und Verfahren

EP4760377 17. Juni 2026

Anmelder: STMicroelectronics International N.V. 🇨🇭

Details

Veröffentlichungs-Nr.
EP4760377
Anmeldetag
9. Dezember 2025
Veröffentlichung
17. Juni 2026
Rechtsraum
EP
IPC
G02F1/01
Offizieller Volltext

Abstract

An integrated photonics device (100), such as a thermal phase shifter, for instance, comprises: a substrate of integrated photonics material having an optical waveguide (110) extending therealong as well as first (112a) and second (112b) lateral strips extending sidewise of the optical waveguide (110) and thermally coupled therewith; first (115a) and second (115b) heat transfer formations, such as arrays of copper pillars, configured to transfer heat from a proximal end distanced away from the first lateral strip (112a) and the second lateral strip (112b) in the substrate of integrated photonics material towards a distal end thermally coupled to the first lateral strip (112a) and the second lateral strip (112b) in the substrate of integrated photonics material; and first (130a) and second (130b) electric heaters thermally coupled with the proximal ends of the first (115a) and second (115b) heat transfer formations. Heat generated by the first (130a) and second (130b) electric heaters is transferred to the optical waveguide (110) via the first (115a) and second (115b) heat transfer formations and the first (112a) and second (112b) lateral strips in the substrate of integrated photonics material.

Anmelder

Firma
STMicroelectronics International N.V.
Land
🇨🇭 Schweiz
🇨🇭 STMicroelectronics International

Schweizer Gesellschaft des Halbleiterkonzerns STMicroelectronics, die Chips und Sensoren für Automobiltechnik, Industrie und Unterhaltungselektronik entwickelt.

733 Patente in unserer Datenbank

Vertreten von

  • Buzzi, Notaro & Antonielli d'Oulx S.p.A.

Noch Fragen?

Wir helfen Ihnen gerne weiter. Schreiben Sie uns einfach.

Kontakt aufnehmen