Wärmeableitungsmodul, Elektronische Vorrichtung und Wärmeableitungsverfahren

Details

Veröffentlichungs-Nr.

EP4760455

Anmeldetag

22. Juli 2024

Veröffentlichung

27. März 2025

Rechtsraum

EP

IPC

G06F1/20

Abstract

This application relates to the technical field of electronic devices, and provides a heat dissipation module, an electronic device, and a heat dissipation method. The electronic device can have both a light and thin design and a heat dissipation performance. The heat dissipation module includes a heat conduction plate, a heat spreader, and a first flow channel. The heat conduction plate is configured to be in heat conduction connection to a heat generating element. The heat spreader is located on a side of the heat conduction plate facing away from the heat generating element and is in heat conduction connection to the heat conduction plate. The first flow channel is located between the heat conduction plate and the heat spreader, a part of an inner wall of the first flow channel is formed by the heat conduction plate, and a cooling medium is provided in the first flow channel.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China