Spulenmodul und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4760759

Anmeldetag

17. Dezember 2024

Veröffentlichung

4. Dezember 2025

Rechtsraum

EP

IPC

H01F27/28

Abstract

This application provides a coil module and an electronic device, and relates to the field of circuit board technologies. A high-speed signal cable and a wireless charging coil are integrated into a same coil module. The coil module may include: a substrate and a metal layer formed on one side of the substrate, where the metal layer includes a thick metal region, a thin metal region, and a transition region located in a junction region between the thick metal region and the thin metal region, the wireless charging coil is disposed in the thick metal region, the high-speed signal cable is disposed in the thin metal region, a first nanocrystal and a second nanocrystal are disposed opposite to each other on two sides of the substrate, at least a part of a periphery of the wireless charging coil is covered with the first nanocrystal, the first nanocrystal extends to be above the transition region, and at least a part of the wireless charging coil is covered with the second nanocrystal. Integration can be improved, space resources can be saved, and the high-speed signal cable and the wireless charging coil are remotely deployed by using the transition region, so that quality of respective signals of the high-speed signal cable and the wireless charging coil are not affected.

Anmelder

Firma

HUAWEI TECHNOLOGIES CO., LTD.

Land

🇨🇳 China