Verbinderanordnung

EP4760997 17. Juni 2026

Anmelder: Japan Aviation Electronics Industry, Ltd. 🇯🇵

Details

Veröffentlichungs-Nr.
EP4760997
Anmeldetag
5. November 2025
Veröffentlichung
17. Juni 2026
Rechtsraum
EP
Offizieller Volltext

Abstract

A technique for easily attaching/detaching a connector to/from a substrate is provided. A connector assembly (500) according to the present disclosure includes: a frame (300) that can be disposed in a substrate (700) including a plurality of pads (702); and a connector (100) that is detachably connected to the frame (300). The connector (100) includes a shell (110) that holds a plurality of contacts (121A), and a connector contacting part. The frame (300) includes a frame contacting part. When the frame (300) is disposed in the substrate (700) and the connector (100) is attached to the frame (300), the plurality of contacts (121A) are pushed against the plurality of respective pads (702), elastically deformed, and electrically connected to the plurality of respective pads (702), and the connector contacting part receives a reaction force from the plurality of contacts (121A) and contacts the frame contacting part.

Anmelder

Firma
Japan Aviation Electronics Industry, Ltd.
Land
🇯🇵 Japan
🇯🇵 Japan Aviation Electronics Industry

Japanischer Hersteller elektronischer Steckverbinder und Sensoren mit Sitz in Tokio, mehrheitlich im Besitz des Elektronikkonzerns Alps Alpine.

725 Patente in unserer Datenbank

Vertreten von

  • INNOV-GROUP

Noch Fragen?

Wir helfen Ihnen gerne weiter. Schreiben Sie uns einfach.

Kontakt aufnehmen