Flüssigkeitskühlung von Elektronischen Mikrochips mit Gestapelter Architektur

Details

Veröffentlichungs-Nr.

EP4761488

Anmeldetag

16. Dezember 2025

Veröffentlichung

17. Juni 2026

Rechtsraum

EP

IPC

H05K7/20, G06F1/20, H10W40/47

Abstract

A cooling system (100) includes a heat removal device (102) operable to cool a stacked microchip assembly (64). The heat removal device (102) includes a structure (104) having a first end (106), a second end (108), at least one sidewall (110) extending between and connecting the first end (106) and the second end (108), and a hollow interior. The stacked microchip assembly (64) is positionable within the hollow interior. An inlet cavity (112) and an outlet cavity (114) are arranged within the hollow interior and are fluidly connectable to at least one passageway (66) formed in the stacked microchip assembly (64). An inlet opening (116) is formed in the structure (102) and is fluidly connected with the inlet cavity (112). An outlet opening (118) formed in the structure (102) is fluidly connected with the outlet cavity (114). A first cooling fluid (C1) is movable from the inlet cavity (112) to the outlet cavity (114) through the at least one passageway (66) formed in the stacked microchip assembly (64).

Anmelder

Firma

Carrier Corporation

Land

🇺🇸 USA