Halbleiteranordnung

Details

Veröffentlichungs-Nr.

EP4761562

Anmeldetag

5. Dezember 2025

Veröffentlichung

17. Juni 2026

Rechtsraum

EP

Abstract

A semiconductor device (1) includes a semiconductor module (4), a component-embedded substrate (3), a support substrate (2) on which these components are mounted, and a wiring layer (7). The component-embedded substrate includes an electronic component (31, 32). The component-embedded substrate has a height equal to a height of the semiconductor module, and the electronic component has a height different from the height of the semiconductor module. The wiring layer includes wiring sections (72) each electrically connected to the power semiconductor element or the electronic component. The wiring layer is disposed on an opposite side of the semiconductor module and the component-embedded substrate from the support substrate. The electronic component has a terminal (311, 312) connected to a corresponding wiring section among the wiring sections. The terminal is positioned closer to the wiring layer than to the support substrate.

Anmelder

Firmen

DENSO CORPORATION
MIRISE Technologies Corporation

Land

🇯🇵 Japan