Elektronisches Bauteil und Form

Details

Veröffentlichungs-Nr.

EP4765171

Anmeldetag

12. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

Abstract

There are provided an electronic component that can be manufactured without reducing production efficiency while preventing a resin from leaking when a bobbin is sealed with the resin, and a mold for sealing the electronic component with the resin. The invention relates to an electronic component including a bobbin on a coil is mounted; a connecting terminal 31 to which one end of the coil is connected and which is fixed to the bobbin; and a mold resin 41 with which the bobbin, the coil, and a part of the connecting terminal 31 are sealed. The bobbin includes an exposed portion 21a exposed from the mold resin 41, and an end portion 31b of the connecting terminal 31 opposite to an end portion 31a to which the one end of the coil is connected protrudes outward from the exposed portion 21a.

Anmelder

Firma

Shindengen Electric Manufacturing Co., Ltd.

Land

🇯🇵 Japan