Mehrschichtplatte

Details

Veröffentlichungs-Nr.

EP4766038

Anmeldetag

3. Dezember 2025

Veröffentlichung

24. Juni 2026

Rechtsraum

EP

IPC

H05K1/11, H05K3/341

Abstract

A multilayer board includes a first conductor layer, a second conductor layer, and an insulating layer. The first conductor layer and the second conductor layer are stacked via the insulating layer. The first conductor layer includes a plurality of lands to which an electrode of an electronic component for surface mounting is to be soldered. The second conductor layer includes an interconnect pattern electrically connected to the lands via a conductive through-hole formed in the insulating layer. The plurality of lands have a same planar shape.

Anmelder

Firma

Alps Alpine Co., Ltd.

Land

🇯🇵 Japan